PCB工程英文翻譯公司-常用術(shù)語(yǔ)和句子翻譯-上海譯境整理

工 程 英 文 確 認(rèn) 常 用 詞 及 常 用 語(yǔ) 句 匯 總

厚度	公差	線路層	孔層	阻焊層
字符層	外形層	疊層

單詞

1.       附件：attached

2.       樣品：sample

3.       承認(rèn)：approval

4.       答復(fù)：answer;reply

5.       規(guī)格：spec

6.       與...同樣的：the same as

7.       前版本：previous version(old version)

8.       生產(chǎn)：production

9.       確認(rèn)：confirm

10.   再次確認(rèn)：double confirm

11.   工程問(wèn)題：engineering query（EQ）

12.   盡快：ASAP(as soon as possible)

13.   生產(chǎn)文件：production gerber

14.   聯(lián)系某人：contact somebody

15.   提交樣板：submit sample

16.   交貨期：delivery date

17.   電測(cè)成本：ET（electrical test） cost

18.   通斷測(cè)試：Open and short testing

19.   參考：refer to

20.   IPC標(biāo)準(zhǔn)：IPC standard

21.   IPC二級(jí)：IPC class 2

22.   可接受的：acceptable

23.   允許：permit

24.   制造：manufacture

25.   修改：revision

26.   公差：tolerance

27.   忽略：ignore(omit)

28.   工具孔：tooling hole

29.   安裝孔：mounting hole

30.   元件孔：component hole

31.   槽孔：slot

32.   郵票孔：snap off hole

33.   導(dǎo)通孔：via

34.   盲孔： blind via

35.   埋孔：buried via

36.   金屬化孔：PTH(plating through hole)

37.   非金屬化孔：NPTH( no plating through hole)

38.   孔位：hole location

39.   避免：avoid

40.   原設(shè)計(jì)：original design

41.   修改：modify

42.   按原設(shè)計(jì)：leave it as it is

43.   附邊：waste tab

44.   銅條：copper strip

45.   拼板強(qiáng)度：panel strong

46.   板厚：board thickness

47.   刪除：remove(delete)

48.   削銅：shave the copper

49.   露銅：copper exposure

50.   光標(biāo)點(diǎn)：fiducial mark

51.   不同：be different from(differ from)

52.   內(nèi)?。?/span>inside radius

53.   焊環(huán)：annular ring

54.   單板尺寸：single size

55.   拼板尺寸：panel size

56.   銑：routing

57.   銑刀：router

58.   V-cut：scoring

59.   啞光：matt

60.   光亮的：glossy

61.   錫珠：solder ball(solder plugs)

62.   阻焊：solder mask(solder resist)

63.   阻焊開(kāi)窗：solder mask opening

64.   單面開(kāi)窗：single side mask opening

65.   補(bǔ)油：touch up solder mask

66.   補(bǔ)線：track welds

67.   毛刺：burrs

68.   去毛刺：deburr

69.   鍍層厚度：plating thickness

70.   清潔度：cleanliness

71.   離子污染：ionic contamination

72.   阻燃性：flammability retardant

73.   黑化：black oxidation

74.   棕化：brown oxidation

75.   紅化：red oxidation

76.   可焊性：solderability

77.   焊料：solder

78.   包裝：packaging

79.   角標(biāo)：corner mark

80.   特性阻抗：characteristic impedance

81.   正像：positive

82.   負(fù)片：negative

83.   鏡像：mirror

84.   線寬：conductor width

85.   線距：conductor spacing

86.   做樣：build sample

87.   按照：as per

88.   成品：finished

89.   做變更：make the change

90.   相類(lèi)似：similar to

91.   規(guī)格：specification

92.   下移：shift down

93.   垂直地：vertically

94.   水平的：horizontally

95.   增大：increase

96.   縮?。?/span>decrease

97.   表面處理：Surface Finishing 

98.   波峰焊：wave solder

99.   鉆孔數(shù)據(jù)：drilling date

100.  標(biāo)記：Logo

101.  Ul 標(biāo)記：Ul Marking

102.  蝕刻標(biāo)記：etched marking

103.  周期：date code

104.  翹曲：bow and twist

105.  外層：outer layer

106.  內(nèi)層：internal layer

107.  頂層：top layer

108.  底層：bottom layer

109.  元件面：component side

110.  焊接面：solder side

111.  阻焊層：solder mask layer

112.  絲印層：legend layer (silkscreen layer or over layer)

113.  蘭膠層：peelable SM layer

114.  貼片層：paste mask layer

115.  碳油層：carbon layer

116.  外形層：outline layer(profile layer)

117.  白油：white ink

118.  綠油：green ink

119.  噴錫：hot air leveling  (HAL)

120.  水金：flash gold

121.  插頭鍍金：plated gold edge-board contacts

122.  金手指：Gold-finger

123.  防氧化：Entek(OSP)

124.  沉金：Immersion gold (chem. Gold)

125.  沉錫：Immersion Tin(chem.Tin)

126.  沉銀：Immersion Silver (chem. silver)

127.  單面板：single sided board

128.  雙面板：double sided board

129.  多層板：multilayer board

130.  剛性板：rigid board

131.  撓性板：flexible board

132.  剛撓板：flex-rigid board

133.  銑：CNC (mill , routing)

134.  沖：punching

135.  倒角：beveling

136.  倒斜角：chamfer

137.  倒圓角：fillet

138.  尺寸：dimension

139.  材料：material

140.  介電常數(shù)：Dielectric constant

141.  菲林：film

142.  成像：Imaging

143.  板鍍：Panel Plating

144.  圖鍍：Pattern Plating

145.  后清洗：Final Cleaning

146.  疊層：layup (stack-up)

147.  污染焊盤(pán)：contaminate pad

148.  分孔圖：drill chart

149.  度數(shù)：degree

150.  被…覆蓋：be covered with

151.  負(fù)公差：minus tolerance

152.  標(biāo)靶盤(pán)： target pad

153.  外形公差：routing tolerance

154.  芯板：core

常用語(yǔ)句

－、厚度

1. 要求孔內(nèi)銅厚0.001"太緊對(duì)我們的生產(chǎn)，建議按IPC二級(jí)0.0008"。

The copper thickness of the wall of the plated-through holes is specified 0.001". It's too tight for our production. We suggest as per IPC class 2.that's to say ,It's 0.0008" .

2.要求金手指鍍金厚度為1.2-1.5um，我們加工太困難，建議按我們常規(guī)0.45um。

The plating thickness of Au in edge contact is specified 1.2-1.5um,it is too tough for us, we suggest following our normal standard ,that is to say 0.45um instead.

3.建議所要求的銅厚2OZ為成品銅厚，而且我們將用基銅1.5OZ電鍍到2OZ。

The copper thickness is specified 2OZ .We suggest the finished copper thickness 2OZ. And we will use the base material with 1.5OZ copper thickness and plate to 2OZ for our production.

4.要求錫厚為0.0005-0.003"，我們做不到這么厚，建議按IPC二級(jí)，即保證可焊性，

The solder thickness is required to plated 0.0005-0.003" ,We can not reach  the requirement .We suggest following IPC class 2 for the solder thickness and we will assure the solderability.

二、公差

1. XXX.的尺寸公差為+/-0.005，這要求是太緊對(duì)我們生產(chǎn)，建議公差放松到+/-0.008"。

The tolerance of dimension  is specified XXX.+/-0.005" .It is tight for our production .We suggest +/-0.008" instead。

2.在*.pdf文件中要求外形公差為+/-0.005"，建議按IPC 二級(jí)+/-0.01"代替。

The profile tolerance is specified +/-0.005" in *.pdf file. We suggest as per IPC class 2，that is to say, it is +/-0.01".

3. 在疊層圖中要求板厚公差為+/-0.007"，而notes 1中要求板厚公差為+/-0.005"，他們是不同的，建議0.062"+/-0.007"是可接受的，因?yàn)?/span>+/-0.005"對(duì)我們來(lái)說(shuō)太難控制了。

The tolerance of the board thickness is specified +/-0.007" in layup detail which is different form NOTES 1 +/-0.005".We suggest  0.062"+/-0.007" is acceptable for +/-0.005" is very tough for us to control.

4.外形公差要求+/-0.1mm，這超出了我們生產(chǎn)，建議按+/-0.2mm控制。

The tolerance of the outline is specified +/-0.1mm.It's above us.We suggest +/-0.2mm instead.

5. v-cut留厚公差為+/-0.06mm上下偏移公差為+/-0.05mm，這兩個(gè)公差都太緊，建議兩個(gè)公差都按+/-0.1mm控制。

The remain tolerance of v-cut is specified +/-0.06mm and offset tolerance is +/-0.05mm. they are too tight for us,we suggest both tolerance are +/-0.1mm instead.

6.孔位公差為0.05mm，這是太緊對(duì)我們，建議用+/-0.076mm替代。

The tolerance of the hole position is specified 0.05mm. It's too tight for us, We suggest +/-0.076mm instead.

7. 角度公差為+/-0.5mm，這是太緊對(duì)我們，v-cut角度我們將控制在30+/-5度。

The tolerance of angle is +/-0.5 degree ,it is tight for us , we would like to control the angle of v-cut within 30+/-5 degree.

8.在1MB5476-01.pdf文件中要求孔到板中心的公差是+/-0.05mm，這是太緊對(duì)我們，建議安IPC二級(jí)。

It is special that the tolerance of the hole to board center is +/-0.05mm in the 1MB5476-01.pdf file,it is too tight for us ,we suggest as per IPC class 2 .

9.要求線寬和線間距公差為+/-0.03，這是太緊對(duì)我們，請(qǐng)確認(rèn)放松到+/-20%。

It stated that conductor width and spacing shall be within +/-0.03(0.001) of gerber data , it is tight for us , we would like to relax to +/-20%.Pls confirm.

10.Φ3.0的孔徑公差要求+0.05mm，這太緊對(duì)我們，請(qǐng)確認(rèn)放松到+0.1/-0mm。

The tolerance of the holes with diameter 3.0mm is required to control within +0.05mm ,it is tight for us , we would like to relax to +0.1/-0mm.Pls confirm.

三、線路層

1.兩個(gè)孔到外形很近，這將引起露銅和破孔，建議允許露銅與破孔。

Two holes are near the outline,it will cause copper exposed and hole broken,we suggest copper exposed and hole broken is permitable.

2.有些盤(pán)離外形很近，建議削銅皮0.4mm，避免露銅。

Some pads are close to the outline .We suggest shaving the pads about 0.4mm avoid to the copper exposure.

3. 焊盤(pán)延伸出板外，如按原設(shè)計(jì)，板邊將會(huì)露銅，建議允許露銅。

The copper pad extend to the board outline, it will lead to copper exposed  if we follow Gerber to do,We suggest copper exposed is acceptable.

4.有三個(gè)盤(pán)離v-cut 線很近將會(huì)引起露銅，建議削焊盤(pán)0.4mm避免露銅。

The three pads are so close to the v-cut that they will cause copper exposure. We suggest shaving the pads 0.4mm avoid to the copper exposure.

5.底層有些地方線路網(wǎng)格間距僅有0.178mm，這種網(wǎng)格間距我們生產(chǎn)無(wú)法做到，建議減小線寬使間距達(dá)到0.2mm.

The copper grids  on bottom side is only 0.178mm in some places,we can not do it per this gap,so we suggest decreasing the trace width  to make copper grids to 0.2mm.

6. 既然沒(méi)有功能上的影響，我們建議所有層附邊均加些銅皮以提高電鍍質(zhì)量。

We suggest putting some extra copper on the waste tab in all layers to improve plating quality since this is no function effect.

7.建議加在頂層空白區(qū)域加些銅以提高電鍍質(zhì)量。

We suggest putting some copper in blank area on top side to improve plated quality.

8.我們發(fā)現(xiàn)有兩處銅皮間距僅有0.013mm，建議把它們連接起來(lái)。

We have found that the gap between two block copper is only 0.013mm on bottom side,we suggest they are connected.

9. 兩個(gè)光標(biāo)點(diǎn)處在v-cut線上，它們將被削到，我們建議向左邊移1.0mm。

The two fiducial marks are over v-groove line . They will be cut . We suggest moving them 1.0mm toward the left .

四、孔層

1. 兩個(gè)直徑2.0MM的孔，4個(gè)直徑4.0MM的孔，4個(gè)直徑1.3MM的孔雙面沒(méi)有焊盤(pán)，但它們被定義成PTH孔，我們建議做NPTH孔

The 2 holes with dia.2.0mm , 4 holes with dia.4.0mm and 4 holes with dia.1.3mm have no pads on top and bottom copper layer .But they are specified PTH in drill chart. We suggest build them as NPTH.

2．這些孔（直徑1.4MM，1.6mm,1.8mm,2.5mm）被定義成PTH孔，但它們的焊盤(pán)與孔徑等大，我們建議做NPTH孔。

These holes (1.4mm ,1.6mm,1.8mm,2.5mm)are specified PTH .But they have pads which are the same as the holes in copper layer .We suggest them NPTH.

3.六個(gè)直徑0.25MM的孔在分孔圖中定義為NPTH孔，但它們的線路焊盤(pán)比孔大，我們建議做PTH孔。

The 6 holes with dia.0.25mm are specified NPTH in drill chart .But they have pads which are larger  than the holes in copper layers .We sugget them PTH .

4. 直徑0.11“的孔對(duì)應(yīng)的焊盤(pán)比孔大，但它們被定義成NPTH孔，我們建議沿孔邊削銅皮0.3MM ，請(qǐng)確認(rèn)

The hole with dia.0.11" have pad which is larger than the hole in top and bottom copper layer .But it's specified NPTH.we suggest shaving  the pads 0.3mm around the hole.Pls confirm.

5.GERBER中孔的類(lèi)型沒(méi)有定義，2個(gè)直徑0.120“的孔雙面沒(méi)有焊盤(pán)，我們想確認(rèn)這2個(gè)直徑0.120”的孔為NPTH孔。

The hole type(PTH or NPTH) did not be define in the Gerber, the two holes of diameter 0.120 inch have not copper pads on both sides, we would like to confirm the two holes of diameter 0.120 inch are non-plating holes, please confirm .

6.一些1.5mm的孔靠得非常近，建議把他們制成槽孔。

Some holes with dia.1.5mm are very close each other, we suggest doing them oval hole.

7.有兩個(gè)Φ0.991、Φ0.762重疊在一起，建議保留一個(gè)0.991mm的孔。

There are two holes with dia.0.991 mm and dia.0.762 mm overlap each other in one place,we suggest only  dia.0.991mm remain there.

8.在DRD孔表中直徑0.012英寸孔數(shù)是291，而在鉆孔文件中孔數(shù)是290，請(qǐng)確認(rèn)孔數(shù)是290而不是291。

The quantity of diameter 0.012 inch in the hole chart of file DRD is 291, but(thruhole,tap) it is only 290. please confirm the quantity of diameter 0.012 inch holes in the drill flie should be 290 not 291.

9.在孔表中標(biāo)明1.7*1.9mm的槽數(shù)量為4個(gè)，但gerber中僅有兩個(gè)，建議按gerber制作。

In the drilldraw file,it stated that the quantity of slots 1.7*1.9mm is 4 ,but we have found  two slots in the gerber file ,we suggest as per gerber file.

10.因?yàn)殂娡庑螞](méi)有定位孔，我們建議附邊加四個(gè)Φ2.0mm孔。

As no located holes  for our routing,we suggest  four additional holes with dia.2.0mm

in waste tab.

五、阻焊層

1．在字符"J3"處，一些0.065 inch & 0.0461 inch的孔兩面沒(méi)有開(kāi)窗，未避免阻焊污染焊盤(pán)，在對(duì)孔雙面加開(kāi)窗。

On the location of "J3",some holes of diameter 0.065 inch & 0.0461 inch have not mask opening on both sides, we would like to add mask opening for these holes to avoid solder resist encroach the solder pad on both sides.

2.這些焊盤(pán)僅TOP面有阻焊開(kāi)窗，為了避免油墨滲上焊盤(pán)，我們建議在BOTTOM面也加上與TOP面等大的阻焊開(kāi)窗

These pads have single side mask opening on the top side , we suggest extra mask opening on the bottom side with same size as pads to avoid mask onto pad.

3.我們發(fā)現(xiàn)6個(gè)直徑0.8MM的孔雙面沒(méi)有阻焊開(kāi)窗，我們認(rèn)為它們應(yīng)為元件孔，建議雙面加直徑1.75MM的阻焊開(kāi)窗。

We found the 6 holes with dia.0.8mm have not solder-mask opening on both sides. We think they should be component holes. We suggest putting dia.1.75mm solder mask opening on their pads on both sides.

4.我們發(fā)現(xiàn)單板內(nèi)有些光標(biāo)點(diǎn)沒(méi)開(kāi)窗，這點(diǎn)我們應(yīng)該按原設(shè)計(jì)嗎？

We found some fiducials without mask opening in the unit.Should we following the original design?

5.錫珠，小擋點(diǎn)

根據(jù)原設(shè)計(jì)多數(shù)過(guò)孔沒(méi)有開(kāi)窗，它們也沒(méi)有堵孔要求，在我們生產(chǎn)過(guò)程中，因?yàn)榭變?nèi)沒(méi)充滿綠油錫將會(huì)流進(jìn)這些孔內(nèi)，為此我們有三種建議：

建議1：允許部分過(guò)孔孔內(nèi)有錫珠。

建議2：若不同意建議1，我們將對(duì)這些孔雙面加一比孔大些的開(kāi)窗，使用這種方法的結(jié)果是：這些過(guò)孔的孔壁不會(huì)有綠油，過(guò)孔焊盤(pán)被綠油覆蓋但有部分錫環(huán)。

建議3：若不同意以上兩點(diǎn)，我們將對(duì)雙面未開(kāi)窗的過(guò)孔進(jìn)行堵孔，但這將增加成本和增加制程時(shí)間，對(duì)我們來(lái)說(shuō)這種是最不利的選擇。

我們希望你能選擇建議1或建議2。

Most vias have no  solder mask opening  as per original design and no vias-plugged request .During  our process, the solder will flow into the vias ,for they aren't filled with  solder resist completely.So our suggestion have three:

suggestion1 :Solder  ball  in partial  vias is permitted.Pls confirm.

suggestion2: If you don't agree with our suggestion 1, we would like to  put  an opening with a size little larger than  holes  on both side .In this way,the wall of the vias  will have no any solder  resist ,one  partial  pads  will  be  soldered  and  the other will  be covered with solder resist.Pls confirm.

suggestion3: If you don't agree with  above two,we will have to plug   those vias which  have no opening on both side  with solder resist . But  it  will increase  our  production cost  and  cause lead-time much. It is the worst way for us.

We would like to hope you could  choose our suggestion 1or 2.

9. 過(guò)孔要求堵孔，但一些過(guò)孔頂層有開(kāi)窗，建議保留過(guò)孔開(kāi)窗且對(duì)Φ0.46mm的過(guò)孔堵孔。

The via  is  specified  to be plugged. But some vias have mask opening in top layer. We suggest all vias with dia.0.406mm will be plugged and their mask opening in top layer will be kept.

12. 根據(jù)原設(shè)計(jì)光標(biāo)點(diǎn)開(kāi)窗壓到周?chē)男┚€或盤(pán)，建議削光標(biāo)點(diǎn)開(kāi)窗，避免露線。

In the borad ,some soldermask opening of fiducial marks  cover  the nearby traces or pads on top side per original design. We suggest that shave a little  soldermask opening of fiducial marks  to avoid the trace exposed .

14. 開(kāi)窗與線路盤(pán)現(xiàn)狀不同，我們應(yīng)該修改開(kāi)窗使按鍵處全部上金還是依據(jù)原設(shè)計(jì)制作？

The solder mask opening shape mismatch the circuit pad , should we modify the solder mask opening shape to assure all the key pad will be covered with gold completely ,  or we will follow Gerber to do .

15. 能我們使用太陽(yáng)PSR 2000油墨代替太陽(yáng)PSR 4000油墨？因?yàn)槲覀儧](méi)有這類(lèi)型的油墨。

Can we use the solder-mask type with TAYO ink PSR 2000 instead of  TAYO ink PSR 4000 H85?because we have not this type

 

六、字符層

1.大部分的絲印字符都在焊盤(pán)上。我們建議此板沒(méi)有白字，如果需要絲印字符，我們建議刪去上焊盤(pán)的字符。

Most of silkscreen is on the pads, we suggest no silkscreen, if we need to do silkscreen we suggest removal of those which are on pads.

2.原設(shè)計(jì)白油上焊盤(pán)，為了避免油墨污染焊盤(pán)，我們建議削去上焊盤(pán)的白油，請(qǐng)確認(rèn)。

There is white ink on the top pads per original design, We suggest shaving the white ink in case of they contaminate pads. Pls confirm.

3.一些字符靠近焊盤(pán)，恐怕它們會(huì)污染焊盤(pán)，建議允許削少許字符，也就是說(shuō)字符殘缺是允許的。

Some legends are close  to pads .we are afraid they will contaminate the pads.so we suggest shaving them a bit.that is to say the defective legends is permittable.

4.GERBER文件沒(méi)有發(fā)現(xiàn)絲印層，因此建議此板沒(méi)有字符，如果需要絲印字符，請(qǐng)將字符文件發(fā)給我們。

We didn't find any silkscreen layer in gerber file. So we suggest no silkscreen layers .If need ,Pls send us  the file.   

5.在U1和U5區(qū)域，兩個(gè)IC焊盤(pán)的間距只有0.3MM ，如果按原設(shè)計(jì)制作，白油會(huì)污染焊盤(pán)，要不白油做少許更改，白油上焊盤(pán)是允許的。

In U1 & U5 area the gap between two IC pads is only 0.3mm and the white ink will contaminate pads if we follow the original gerber, the other is to make minor change to white ink and IC pads contaminated is allowed.Pls confirm.

6.按原設(shè)計(jì)，字符在大錫面上，是否為了避免白油污染錫面需要削掉白油，或者需要我們按原設(shè)計(jì)制作？請(qǐng)指示

The notation just lie on the large solder pad  per original design , if need us to shave ink to avoid ink contaminate the solder pad or need us to follow gerber to do? please advise.

7. 所有底層字符都沒(méi)鏡像，建議沒(méi)有底層字符或如果要做出他們需要鏡像，請(qǐng)?zhí)岢瞿愕慕ㄗh。

All the legends on bottom side are no mirror per gerber file,we suggest no bottom side silkscreen or they are mirror if we need to do them.Pls advise.

8．在GM4層有些字符，我們忽略它們或是加到頂層？

There are some legends on the GM4,should we omit them or put them on top side silkscreen?

9.由于單元比較小，沒(méi)有足夠的空間加我們的UL標(biāo)志及周期在每個(gè)單元內(nèi)，我們只能絲印我們的UL標(biāo)志及周期在附邊。

As the unit is so small ,there is no large enough bare space to add our UL logo and date code in each unit we have to add our UL logo and date code on the waste tab by silkscreen.

10.我們發(fā)現(xiàn)其他制造商的標(biāo)志及周期在附邊上，我們建議用我們的UL標(biāo)志及周期替代加在附邊上（同樣板一樣），請(qǐng)確認(rèn)。

We find the LOGO and the date code of other PCB manufacture is only in waste tab. We suggest using our LOGO instead.(is only in waste tab the same as the sample.).Pls confirm.

11.頂層字符模糊不清，是否按3.bmp圖示修改？

The legend is illegibility on the top layer silkscreen. Should we modify it  as  3.bmp?

12.板外有些字符和線路，建議刪去,請(qǐng)確認(rèn)。

There are some circuit & notation out of the board,we suggest delete them.pls confirm.

13. 字符層有些網(wǎng)格間距僅有0.076mm,對(duì)我們生產(chǎn)來(lái)說(shuō)間距太小，建議按圖示修改。

In top silkscreen  layer, There is some grids.But the space is only 0.076mm .The space is too small to produce. We suggest modifying these grids like 3.bmp shown.

七、外形層

1. *.DWG中沒(méi)體現(xiàn)拼板方向，建議拼板按照我們附件中的圖所示。

We suggest panelization per our attached drawing for it does not show the unit-pcb's exact direction in the *.DWG.

2. 單板外形與拼板外形不重合，建議按單板調(diào)整外形。

The unit outline cann’t match the  panel profile.We suggest following the unit outline to modify.

3. 標(biāo)注尺寸與實(shí)測(cè)尺寸不同，建議以標(biāo)注尺寸為準(zhǔn)。

The actual gerber dimension is different from the description in drill chart.we suggest per actual gerber.

4.建議v-cut留厚按前版本0.3+/-0.1mm控制。

We suggest the  remain  of  the v-cut  line as  per old version.(0.3+/-0.1mm).

5.要求的v-cut角度是30-45度，但我V-CUT 刀是30, 45,60度，它們的公差是+/-5度，因此我們建議V-CUT角度30+/-5是允許的。

The angle  of  V-CUT  is specified 30-45 degree.But our  normal reamer of V-CUT  is only 30， 45,60 degree.Their tolerance is +/-5  degree .So  we have  to suggest the angle of V-CUT  30+/-5 degree is permitted.

6.建議附邊與拼板相連以增加強(qiáng)度。

We suggest waste tabs connected around the panel to have it stronger.

7. 在gerber 文件中我們沒(méi)有發(fā)現(xiàn)有外形層，請(qǐng)發(fā)外形文件給我們，否則我們無(wú)法制作。

We did not find the  outline of the board in  gerber file ,please send outline gerber file to us,otherwise we can  not manufature this board .

8. 依據(jù)原設(shè)計(jì)槽寬僅有1.0mm，是否允許我們擴(kuò)大成2.0mm，以提高生產(chǎn)效率？

The solts are only 1.0mm in original gerber,can we expand them to 2.0mm to improve our production efficiency?

10. 此板尺寸較大，而郵票孔間距僅有0.15mm,建議增加間距到0.45以提高板的強(qiáng)度。

The gap between snap off holes is only 0.15mm,and the size of board is large. We suggest decreasing the snap off holse (dia.0.599mm) to 0.45mm to get the web stronger.

六、疊層

1.在文件中未指定疊層順序，我們確認(rèn)疊層順序?yàn)椋?/span>top--gnd--In1--In2--pwr—bot。

In the Gerber file, the layup sequence did not be defined, we would like to confirm the layup sequence is as below:top--gnd--In1--In2--pwr--bot.

2. 此板疊層有特殊要求（見(jiàn)圖2”A”所示），但我們沒(méi)有40mil的芯板（注：不含銅厚），我們不得不建議疊層按圖2”B”所示制作。

The  board stack-up is specified.(see A of  picture2),but we haven't no 40mil core.

We have to  suggest board stack-up per B of picture2.

3.文件readme.txt規(guī)定芯板的厚度是0.7+/-0.1MM，我們不能確定0.7MM是否包含銅箔的厚度，我們想確定0.7MM是不含銅厚的，請(qǐng)確認(rèn)

In the readme.txt file ,it is specified that the thickness of inner core is 0.7+/-0.1mm , we don’t know if the core 0.7mm include the copper or not , we would like to confirm the core 0.7mm excluding copper foil ,please confirm

4. 文件readme.txt規(guī)定內(nèi)層的銅箔厚度是18UM ，但我們沒(méi)有0.7MM 18/18UM的芯板，為了縮短產(chǎn)品的交貨時(shí)間，我們是否可以使用35UM銅箔0.7MM的芯板？請(qǐng)確認(rèn)。

In the readme.txt file ,it stated that 18/18um copper inner layer ,but we have not 0.7mm core with 18um copper thickness now ,in order to shorten the lead time of production , can we use 0.7mm core with 35um copper ?

   PCB SPECIAL ENGLISH

1.PCB=Printed Circuit Board    電路板	47.Silkscreen   絲印字符
2.CAM=Computer aided manufacture計(jì)算機(jī)輔助	48.HAL=HASL=Hot air(Solder)leveling 熱風(fēng)整平噴錫
3.Pad  焊盤(pán)	49.Routing   鑼板,銑板
4.Annular ring  焊環(huán)	50.Punching  沖板,啤板
5.AOI=automatic optical inspection  自動(dòng)光學(xué)檢測(cè)	51.FOC=final quality checking 終檢,最后檢查
6.Charge of free    免費(fèi)	52.FOA=final quality audit 最后稽查(抽查)
7.WIP=work in process  在線板	53.Shippment   出貨
8.DCC=document control center  文控中心	54.Flux  松香
9.Legend   字符	55.Au金,Cu銅,Ni鎳,Pb鉛,Tn錫,Tin-lead錫鉛合金
10.CS=Component Side =Top Side （頂層）元件面	56.Lead free   無(wú)鉛
11.SS=Solder Side =Bottom Side  （底層）焊錫面	57.COC=compliance of certificate   材料證明書(shū)
12.Gold Plated   電金，鍍金	58.Microsection=cross section  微切片,橫切片
13.Nickel Plated   電鎳，鍍鎳	59.Chamical gold  沉鎳金
14.Immersion Gold  沉金=沉鎳金	60.Mould=punch die  模具,啤模
15.Carbon Ink Print  印碳油	61.MI=manufacture instruction  制作批示
16.Microsection Report   切片報(bào)告，橫切面報(bào)告	62.QA=quality assurance  品質(zhì)保證
17.X-out=Cross-out  打“X”報(bào)告	63.CAD=computer aided design  計(jì)算機(jī)輔助設(shè)計(jì)
18.Panel （客戶稱）拼板，（生產(chǎn)線稱）工作板	64.Drill bit size鉆咀直徑<diameter>
19.Marking 標(biāo)記，UL 標(biāo)記	65.Bow and twist  板彎和板曲
20.Date code  生產(chǎn)周期	66.Hit 擊打,孔數(shù)
21.Unit  單元，單位	67.Bonding  邦定,點(diǎn)焊
22.Profile  外形，輪廓<outline>	68.Test coupon  測(cè)試模塊(科邦)
23.Profile By Routing 鑼(銑)外形	69.Thieving copper 搶電流銅皮
24.Wet Film  濕菲林,濕綠油,濕膜	70.Rail-web
25.Slot  槽,方坑	71.Break-up tab 工藝邊
26.Base Material=Base Laminate 基材,板料	72.Break away tab 工藝邊
27.V-out =V-score  V形槽	73.GND=ground 地線,大銅皮
28.Finished  成品	74.Hole edge  孔邊,孔內(nèi)
29.Marketing   市場(chǎng)部	75.Stamp hole  郵票孔
30.Gerber File     GERBER文件	76.Template  天坯,型板,鉆孔樣板(首板)
31.UL LOGO     UL標(biāo)記	77.Dry film  干菲林,干膜
32.E-Test=Electric Open/Short Test  電子測(cè)試	78.LPI=liquid photo image  液態(tài)感光=濕綠油
33.PO=Purchase Order   訂單	79.Multilayer  多層板
34.Tolerance   公差	80.SMD=surface mouted device  貼片,表面貼裝器件
35.Rigid,Flexible Board   剛性,軟性板	81.SMT=surface mouted technology  表面貼裝技術(shù)
36.Board cut    開(kāi)料	82.Peelable mask=blue gel 藍(lán)膠
37.Board baking  焗板	83.Tooling hole  工藝孔,管位,定位孔,工具孔
38.Drill    鉆孔	84.Fiducial mask  測(cè)光點(diǎn),光學(xué)對(duì)位點(diǎn),對(duì)光點(diǎn),電眼
39.PTH=Plated Through Hole   鍍通孔,沉銅	85.Copper foil 銅箔
40.Panel plating   板面電鍍,全板電鍍	86.Dimension  尺寸
41.Photo Image   圖象,線路圖形	87.Nagative負(fù)的,positive正的
42.Pattern plating   線路電鍍	88.Flash gold  閃鍍金,鍍薄金
43.Etching   蝕板,蝕刻	89.Engineering department 工程部
44.SM=Solder Mask   防焊,阻焊,綠油	90.Delivery date  交貨期
45.SR=Solder Resist   防焊,阻焊,綠油	91.Bevelling  斜邊
46.Gold finger    金手指	92.Spacing=gap  間隙,氣隙,線隙